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Heat Conduction Double-sided Adhesive Tape

项目介绍:

Product introduction:

Heat conduction double-sided adhesive tape is made by Advanced UV curable heat conductive pressure sensitive adhesive, it has high temperature resistance, better aging resistance, high initial adhesion and high thermal conductivity, die cutting better.

Product Feature:

excellent thermal conductivity

good usage stability 

excellent die cutting performance

good metal bonding performance

providing different thickness(0.05-0.5mm) and different width(1-145cm) according to customer requirements

good post processing

Product application:

The product is used for the assembly of electronic mechanical components, such as between the PVC plate and the aluminum substrate. It is a good heat transfer path between the heating element and the cooling device. It is mainly applicable to the occasion that the structure design does not need other fastening force or can not be fastened in other ways.  It has excellent adhesion strength and thermal conductivity, can be used for heat dissipation and DDR-RAM components assembly, LED light bar components and metal frame shell assembly.

Product structure:

事宜人群:
Information Applied Parameter

Product introduction:

Heat conduction double-sided adhesive tape is made by Advanced UV curable heat conductive pressure sensitive adhesive, it has high temperature resistance, better aging resistance, high initial adhesion and high thermal conductivity, die cutting better.

Product Feature:

excellent thermal conductivity

good usage stability 

excellent die cutting performance

good metal bonding performance

providing different thickness(0.05-0.5mm) and different width(1-145cm) according to customer requirements

good post processing

Product application:

The product is used for the assembly of electronic mechanical components, such as between the PVC plate and the aluminum substrate. It is a good heat transfer path between the heating element and the cooling device. It is mainly applicable to the occasion that the structure design does not need other fastening force or can not be fastened in other ways.  It has excellent adhesion strength and thermal conductivity, can be used for heat dissipation and DDR-RAM components assembly, LED light bar components and metal frame shell assembly.

Product structure:

Heat Conduction Double-sided Adhesive Tape





Part No.

Item

Shipment specification(MM*M)

Substrate

Thickness(mm)

Peel strength(N/25MM)

70°C  Oven 500gweight retention force

Adhesive type

Release Liner

HQ5601

1040*100

none

0.05-0.5

≥15

70℃≥24H

acrylic pressure sensitive adhesive

release paper


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